The Worldwide 3D IC Market and Major Supply Chain Players in Taiwan

Published: Nov, 2015 | Pages: 48 | Publisher: Market Intelligence & Consulting Institute
Industry: Semiconductors | Report Format: Electronic (PDF)

3D IC has the advantages of high density, low power loss and high performance; it utilizes three-dimensional stack architecture to meet the future demand for compact and slim electronic products, and continues Moore's Law of the semiconductor industry. As Taiwan possesses the complete vertical supply chain for semiconductors, the country is suitable for developing three-dimensional stacking technology products, and is helpful in the integration of the semiconductor industry and technology rooting. This report provides an overview of the worldwide 3D IC market, touching on major application and regional markets, and major vendors of 3D IC key components in Taiwan.

List of Topics
Overview of the worldwide 3D IC market, touching on the major development trends and market value by application and by region
Profile of major Taiwanese 3D IC equipment vendors across the supply chain, including an overview of technology and vendors' deployment at various segments of the supply chain, such as photolithography, dry etching, wet etching, coating, bonding, packaging and testing

List of Companies
 Ad-STAC
 Air Liquide
 Air Product
 All Ring Technology
 AMAT
 Amkore
 Apex International
 Ares Green Technology
 Asahi Pretec Taiwan
 Asahi Shih Her Technologies
 ASE
 ASML
 AST
 AUO
 BOC Edwards
 Bosch
 C Sun MFG
 Camtek
 Career Technology
 ChangChun PetroChemical
 Chemleader
 Chilisin Electronics
 Chin Poon Industrial
 ChipMOS
 Compeq Manufacturing
 Cyantek
 DNP
 DNS
 Domino Automation Technology
 Dow Chemical
 Dupont
 Dynamic
 ECIC
 ELS System Technology
 EMAX TECH
 Epistar
 Eternal Materials
 Everlight Chemical
 EVG
 Feedpool Technology
 First Hi-tec Enterprise
 Founder Technology
 Foxconn
 Foxsemicon
 GMT
 Gold Circuit Electronics
 Gongin Precision Industrial
 GoWorld
 GPM
 GPTC
 HannStar Board
 Hermes Microvision
 Hermes-Epitek
 HiKE
 Holtek
 Honghow
 Hua Jung
 Hwasun Quartek
 IBM
 Innolux
 Inotera Memories
 INPAQ Technology
 ITRI
 IV Technologies
 Junze
 Kaijo
 Kaylu Industrial
 King Core
 Kingyoup
 Kinik Company
 Kinsus Interconnect Technology
 KYO
 L&K Engineering
 Lasertec
 Lextar
 Lite-On Technology
 LPI
 Machvision
 Macronix
 Marketech International Corp.
 Maxchip
 MEIKO
 Merk
 Messier-Dowty
 MiTAC
 Mitsubishi
 Mosel Vitelic
 MTC
 Nan Ya PCB
 Nano-Architect Research Corporation
 National Cheng Kung University
 National Tsing Hua University
 NEE
 Nichia
 Omron
 Orbotech
 Photronics
 Powerchip
 Prosys Technology Integration
 PSMC
 PTI
 Rippy
 S.E.S. Co. Ltd.
 Samsung Electro-Mechanics
 Scientech
 Screen
 Shin Her Technology
 Shinko
 Shira
 SHT
 Shuz Tung
 SMIC
 Song Jaan Technology
 Sonix
 SPIL
 Sumitomo
 Sun Rise E&T
 Sunplus
 SUSS
 T.N.E.T.
 Taiwan PCB Techvest
 Taiwan Union Technology
 TCE
 TEL
 Tengsen
 Tesla Motors
 TMC
 Top Creation Machines
 Toppan
 Tripod Technology
 TSMC
 TSR (Tekstarter)
 UMC
 Unimicron Technology
 Unitech
 United Integrated Services
 UTECHZONE
 VIS
 VisEra
 Walsin
 Win Semiconductor
 Winbond Electronics
 Xintec
 YAGEO
 Yuhchang Electric
 Yulon Group
 Zhen Ding Tec

 Table of Contents

1. Worldwide 3D IC Market
1.1 Application Sectors
1.1.1 Consumer Electronics
1.1.2 ICT
1.1.3 Transportation (Automobiles and Aerospace)
1.1.4 Military
1.1.5 Others (Biomedical applications and R&D)
1.2 Regional Markets
1.2.1 North America
1.2.2 Europe
1.2.3 Asia Pacific
1.2.4 Rest of the World
1.3 Summary of the Worldwide 3D IC Market

2. Development of Key 3D IC Component Technologies and Vendors in Taiwan
2.1 Photolithography
2.1.1 Overview of the Technology
2.1.2 Supply Chain Players
2.2 Dry Etching
2.2.1 Overview of the Technology
2.2.2 Supply Chain Players
2.3 Wet Etching/Cleaning
2.3.1 Overview of the Technology
2.3.2 Supply Chain Players
2.4 Coating
2.4.1 Overview of the Technology
2.4.2 Supply Chain Players
2.5 Bonding
2.5.1 Overview of the Technology
2.5.2 Supply Chain Players
2.6 Packaging and Testing
2.6.1 Overview of the Technology
2.6.2 Supply Chain Players
2.7 Summary
Conclusion
Appendix
Glossary of Terms
List of Companies

List of Figures

Figure 1: Worldwide 3D IC Market Value Contributed by Consumer Electronics Sector
Figure 2: Worldwide 3D IC Market Value Contributed by ICT Sector
Figure 3: Worldwide 3D IC Market Value Contributed by Transportation Sector
Figure 4: Worldwide 3D IC Market Value Contributed by Military Sector
Figure 5: Worldwide 3D IC Market Value Contributed by Other Sectors
Figure 6: Worldwide 3D IC Market in 2012 and 2019 by Application Market
Figure 7: Taiwanese 3D IC Equipment Supply Chain
Figure 8: Temporary Bonding
Figure 9: Laser De-bonding
Figure 10: Illustration of CoWoS