Taiwanese IC Packaging & Testing Industry, 3Q 2014

Published: Sep, 2014 | Pages: 14 | Publisher: Market Intelligence & Consulting Institute
Industry: Semiconductors | Report Format: Electronic (PDF)

This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry. Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world. The content of this report is based on primary data obtained through interviews, and publicly available information such as corporate financial statements. The report finds that shipment value of the Taiwanese IC packaging and testing industry grew over 14% to stand at US$3.4 billion in the second quarter of 2014. A further uplift is expected in the third quarter to approximately US$3.5 billion.

List of Companies
Ardentec, ASE, Chipbond, ChipMOS, FATC, KYEC, OSE, PTI, Sigurd, SPIL, Walton.

 List of Topics
Taiwanese IC Packaging and Testing Industry Shipment Value, 1Q 2012 - 4Q 2014 
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 1Q 2012 - 4Q 2014 
Taiwanese IC Packaging Industry Shipment Value , 1Q 2012 - 4Q 2014 
Taiwanese IC Testing Industry Shipment Value , 1Q 2012 - 4Q 2014 
Taiwanese IC Packaging Industry's Shipment Value Rankings, 1Q 2012 - 2Q 2014 
Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 1Q 2012 - 2Q 2014 
Taiwanese IC Testing Industry's Shipment Value Rankings, 1Q 2012 - 2Q 2014 
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 1Q 2012 - 2Q 2014 
Taiwanese IC Packaging Industry Shipment Value by Shipment Destination, 1Q 2012 - 2Q 2014 
Taiwanese IC Packaging Industry Shipment Value Share by Shipment Destination, 1Q 2012 - 2Q 2014 
Taiwanese IC Testing Industry Shipment Value by Shipment Destination, 1Q 2012 - 2Q 2014 
Taiwanese IC Testing Industry Shipment Value Share by Shipment Destination, 1Q 2012 - 2Q 2014 
Exchange Rate, 4Q 2010 - 2Q 2014 

Research Scope & Definitions