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Published: Jun, 2015 | Pages:
12 | Publisher: Market Intelligence & Consulting Institute
Industry: ICT | Report Format: Electronic (PDF)
This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry. Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world. The content of this report is based on primary data obtained through interviews, and publicly available information such as corporate financial statements. The report finds that shipment value of the Taiwanese IC packaging and testing industry totaled around US$3.1 billion in the first quarter of 2015, slipping 9.1% sequentially. The industry's shipment value is expected to rebound to approximately US$3.2 billion in the second quarter of 2015. List of Compaines Ardentec,ASE,Chipbond,ChipMOS,FATC,KYEC,OSE,PTI,Sigurd,SPIL,Walto
Table of Contents Taiwanese IC Packaging and Testing Industry Shipment Value, 4Q 2012 - 3Q 2015 Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 4Q 2012 - 3Q 2015 Taiwanese IC Packaging Industry Shipment Value , 4Q 2012 - 3Q 2015 Taiwanese IC Testing Industry Shipment Value , 4Q 2012 - 3Q 2015 Taiwanese IC Packaging Industry's Shipment Value Rankings, 4Q 2012 - 1Q 2015 Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 4Q 2012 - 1Q 2015 Taiwanese IC Testing Industry's Shipment Value Rankings, 4Q 2012 - 1Q 2015 Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 4Q 2012 - 1Q 2015 Taiwanese IC Packaging Industry Shipment Value by Shipment Destination, 4Q 2012 - 1Q 2015 Taiwanese IC Packaging Industry Shipment Value Share by Shipment Destination, 4Q 2012 - 1Q 2015 Taiwanese IC Testing Industry Shipment Value by Shipment Destination, 4Q 2012 - 1Q 2015 Taiwanese IC Testing Industry Shipment Value Share by Shipment Destination, 4Q 2012 - 1Q 2015 Exchange Rate, 4Q 2012 - 1Q 2015 Research Scope & Definitions
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